Difference between revisions of "Drying of printed circuit boards"
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Literature: BAT for the surface treatment of metals & plastics, 2006 | Literature: BAT for the surface treatment of metals & plastics, 2006 | ||
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| + | === Typical process parameters === | ||
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| + | {| border="1" | ||
| + | | align="center" style="background:#2266CC;"|'''Process''' | ||
| + | | align="center" style="background:#2266CC;"|'''Temperature [°C]''' | ||
| + | | align="center" style="background:#2266CC;"|'''Heat transfer medium''' | ||
| + | | align="center" style="background:#2266CC;"|'''Residence time''' | ||
| + | | align="center" style="background:#2266CC;"|'''Details''' | ||
| + | | align="center" style="background:#2266CC;"|'''Literature''' | ||
| + | |- | ||
| + | | style="background:#AACCEE;"| Drying of solder mask || align="center"| up to 50 °C|| align="center"| air || align="center"| continious || align=”center”| || rowspan="1" align="center"| Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. | ||
| + | |} | ||
Back to [[Subsection DJ metals|EFFICIENCY FINDER FOR METAL INDUSTRY]] | Back to [[Subsection DJ metals|EFFICIENCY FINDER FOR METAL INDUSTRY]] | ||
Latest revision as of 13:08, 1 September 2016
Back to EFFICIENCY FINDER FOR METAL INDUSTRY
- Drying of printed circuit boards
Example flowsheet:
Literature: BAT for the surface treatment of metals & plastics, 2006
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| Drying of solder mask | up to 50 °C | air | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
