Drying of printed circuit boards

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  • Drying of printed circuit boards

Example flowsheet:


Drying in printed circuit board.jpg

Literature: BAT for the surface treatment of metals & plastics, 2006


Typical process parameters

Process Temperature [°C] Heat transfer medium Residence time Details Literature
Drying of solder mask up to 50 °C air continious Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.


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