Difference between revisions of "EFFICIENCY FINDER"

Revision as of 14:05, 31 August 2016

		technologies		industry sectors
		solar integration schemas	heat pump integration schemas	Subsection DC automotive	Subsection DG chemicals	Subsection DA food	Subsection DC leather	Subsection DC metals	Subsection DC paper	Subsection DC textiles
		INFO	INFO	INFO	INFO	INFO	INFO	INFO	INFO	INFO
CP, EE, RE, PI					x	x	x	x	x	x
UNIT OPERATIONS	CLEANING	info	info	x	x	x	x	x	x	x
	CASTING	info	info	x				x
	PRESSING	info	info						x
	DRYING	info	info	x		x	x	x	x	x
	EVAPORATION AND DISTILLATION	info	info			x
	BLANCHING	info	info			x
	PASTEURIZATION	info	info			x
	STERILIZATION	info	info			x
	COOKING	info	info			x				x
	OTHER PROCESS HEATING	info	info	x	x	x		x	x	x
	GENERAL PROCESS HEATING	info	info			x
	HEATING OF PRODUCTION HALLS	info	info			x
	COOLING OF PRODUCTION HALLS		info			x
	COOLING PROCESSES		info	x	x	x		x
	MELTING	info	info			x
	EXTRACTION				x	x
	SIZING								x
	BLEACHING			x		x	x			x
	PAINTING			x			x		x	x
	SURFACE TREATMENT	info	info	x			x	x
	LAMINATION			x				x

@@ Line 50: / Line 50: @@
 |style="background:#EECC22"|'''[[surface treatment|SURFACE TREATMENT]]'''||[[Solar application for surface treatment|info]]||info||[[Subsection DC automotive|x]]|||||||[[Coating of hides and skins|x]]||[[Surface treatment in metal industry|x]]|||||
 |-
-|style="background:#EECC22"|'''[[Lamination|LAMINATION]]'''||||||[[Lamination of printed circuit boards|x]]|||||||[[Lamination of printed circuit boards|x]]|||||
+|style="background:#EECC22"|'''[[Lamination|LAMINATION]]'''||||||[[Lamination of printed circuit boards|x]]|||||||||[[Lamination of printed circuit boards|x]]|||||
 |-
 |}