Difference between revisions of "Etching and descalling of printed circuit board"
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| align="center" style="background:#2266CC;"|'''Literature''' | | align="center" style="background:#2266CC;"|'''Literature''' | ||
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| − | | style="background:#AACCEE;"| PCB etching|| align="center"| 20- | + | | style="background:#AACCEE;"| PCB etching|| align="center"| 20-45°C|| align="center"| Copper: 145-170 g/l, halide: 235-265 g/l, content of chloride: 4-4,5 mol/l|||| align="center"| pH: 8-9,5|| |
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| + | | style="background:#AACCEE;"| PCB etching|| align="center"| 50-80°C|| align="center"| || align="center"| || align="center"| water and chemicals || align="center"|Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. | ||
|} | |} | ||
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Latest revision as of 11:58, 1 September 2016
Back to EFFICIENCY FINDER FOR METAL INDUSTRY
- Circuit board etching
Example flowsheet:
Literature: Bat for the surface treatment of metals & plastics, 2006
- Typical parameters of the process
| Process | Temperature [°C] | Residence time | Chemicals | Details | Literature |
| PCB etching | 20-45°C | Copper: 145-170 g/l, halide: 235-265 g/l, content of chloride: 4-4,5 mol/l | pH: 8-9,5 | ||
| PCB etching | 50-80°C | water and chemicals | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
