Difference between revisions of "Metal stripping of printed circuit boards"

From Efficiency Finder
Jump to: navigation, search
m (Protected "Metal stripping of printed circuit boards" [edit=autoconfirmed:move=autoconfirmed])
m (Changed protection level for "Metal stripping of printed circuit boards" (‎[edit=sysop] (indefinite) ‎[move=sysop] (indefinite)))
 
(No difference)

Latest revision as of 17:49, 13 February 2013

Back to EFFICIENCY FINDER FOR METAL INDUSTRY


  • Typical parameters of the process
Process Temperature [°C] Heat transfer medium Residence time Chemicals Concentration [g/l] Details Literature
Tin stripping of PCB: Stage 1 25-35 20-60 sec hydrogen tetrafluorborate, tin fluorborate or nitric acid solutions BAT for the surface treatment of metals & plastics, 2005
Tin stripping of PCB: Stage 2 25-35 10-30 sec hydrogen tetrafluorborate, tin fluorborate or nitric acid solutions


Back to EFFICIENCY FINDER FOR METAL INDUSTRY