Metal stripping of printed circuit boards
From Efficiency Finder
Revision as of 17:49, 13 February 2013 by Breka (Talk | contribs) (Changed protection level for "Metal stripping of printed circuit boards" ([edit=sysop] (indefinite) [move=sysop] (indefinite)))
Back to EFFICIENCY FINDER FOR METAL INDUSTRY
- Typical parameters of the process
| Process | Temperature [°C] | Heat transfer medium | Residence time | Chemicals | Concentration [g/l] | Details | Literature |
| Tin stripping of PCB: Stage 1 | 25-35 | 20-60 sec | hydrogen tetrafluorborate, tin fluorborate or nitric acid solutions | BAT for the surface treatment of metals & plastics, 2005 | |||
| Tin stripping of PCB: Stage 2 | 25-35 | 10-30 sec | hydrogen tetrafluorborate, tin fluorborate or nitric acid solutions |
