Difference between revisions of "Pickling of printed circuit boards"
From Efficiency Finder
(Created page with "Back to Subsection DC metals === Typical process parameters === {| border="1" | align="center" style="background:#2266CC;"|'''Process''' | align="center" style="backgrou...") |
(No difference)
|
Revision as of 11:54, 1 September 2016
Back to Subsection DC metals
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| Pickling | 45 °C | water and chemicals | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
Back to Subsection DC metals
