Pickling of printed circuit boards

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Typical process parameters

Process Temperature [°C] Heat transfer medium Residence time Details Literature
Pickling 45 °C water and chemicals continious Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.

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