Difference between revisions of "Plating tin and alloy in printed circuit boards"

Latest revision as of 12:06, 1 September 2016

Example flowsheet:

Literature: Bat for the surface treatment of metals & plastics, 2006

Process	Temperature [°C]	Heat transfer medium	Residence time	Details	Literature
chemical coating	20-45 °C	water and chemicals	continious		Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.
zinc alloy	>180 °C	zinc	continious
purification	up to 70 °C	acid or alkaline solution	continious

@@ Line 4: / Line 4: @@
 *;Circuit board tin plating
+=== General description ===
 Example flowsheet:
@@ Line 13: / Line 15: @@
 Literature: Bat for the surface treatment of metals & plastics, 2006
+=== Typical process parameters ===
+{| border="1"
+| align="center" style="background:#2266CC;"|'''Process'''
+| align="center" style="background:#2266CC;"|'''Temperature [°C]'''
+| align="center" style="background:#2266CC;"|'''Heat transfer medium'''
+| align="center" style="background:#2266CC;"|'''Residence time'''
+| align="center" style="background:#2266CC;"|'''Details'''
+| align="center" style="background:#2266CC;"|'''Literature'''
+|-
+| style="background:#AACCEE;"| chemical coating || align="center"| 20-45 °C|| align="center"| water and chemicals || align="center"| continious || align=”center”|  || rowspan="3" align="center"| Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.
+|-
+| style="background:#AACCEE;"| zinc alloy || align="center"| >180 °C|| align="center"| zinc || align="center"| continious || align=”center”|
+|-
+| style="background:#AACCEE;"| purification || align="center"| up to 70 °C|| align="center"| acid or alkaline solution || align="center"| continious || align=”center”|
+|}
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