Difference between revisions of "Plating zinc and zinc alloy in printed circuit boards"
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| − | | style="background:#AACCEE;"| zinc alloy || align="center"| >180 °C|| align="center"| zinc || align="center"| continious || align=”center”| | + | | style="background:#AACCEE;"| zinc alloy || align="center"| >180 °C|| align="center"| zinc || align="center"| continious || align=”center”| || align="center"| Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
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Back to [[Subsection DC metals]] | Back to [[Subsection DC metals]] | ||
Revision as of 12:57, 1 September 2016
Back to Subsection DC metals
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| zinc alloy | >180 °C | zinc | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
Back to Subsection DC metals
