Difference between revisions of "Plating zinc and zinc alloy in printed circuit boards"
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=== Typical process parameters === | === Typical process parameters === | ||
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Latest revision as of 08:50, 6 September 2016
Back to EFFICIENCY FINDER FOR METAL INDUSTRY
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| zinc alloy | >180 °C | zinc | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
