Difference between revisions of "Plating zinc and zinc alloy in printed circuit boards"
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Revision as of 12:56, 1 September 2016
Back to Subsection DC metals
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| zinc alloy | >180 °C | zinc | continious |
Back to Subsection DC metals
