Plating zinc and zinc alloy in printed circuit boards

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Typical process parameters

Process	Temperature [°C]	Heat transfer medium	Residence time	Details	Literature
zinc alloy	>180 °C	zinc	continious		Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg.

Back to Subsection DC metals

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