Difference between revisions of "Solvent degreasing of printed circuit boards"
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Back to Subsection DC metals
Typical process parameters
| Process | Temperature [°C] | Heat transfer medium | Residence time | Details | Literature |
| Rinsing and degreasing | 30-50 °C | water and chemicals | continious | Risse, A. (2012). Leiterplattentechnologie. In Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik. Springer Berlin Heidelberg. |
Back to Subsection DC metals
